According to the characteristics of the CMP process of sapphire processing, we developed water-based alkaline PH Colloidal Silica.
Kona Sapphire Colloidal Silica is especially developed for Sapphire, with increased abrasive particle size, which can improve the removal rate as well as no compromise with high quality surface.
Aluminium rough and final polishing slurry developed for C- Plane Sapphire, with a fast removal rate and controlled surface finish.
C-plane sapphire is widely used in LED substrate materials and consumer electronics because of its high transparency and hardness, abrasion resistance and scratch resistance, high temperature resistance, not easy to break and other characteristics.
Kona provides boron carbide and diamond slurry for C-plane sapphire sapphire grinding, increased abrasive particle size silica colloidal for polishing to achieve a good surface finish, also provide alumina slurry for polishing with a faster removal rate and controlled surface finish.
|Silica colloidal for sapphire
|C-plane sapphire polishing slurry