Silicon Wafer Grinding/Polishing Colloidal Silica

Silicon Wafer Polishing Slurry Features

• Kona provides a series of lapping &polishing powders and slurry for Silicon wafer lapping、rough polishing and final polishing, used in the chemical mechanical planarization process of Silicon wafer.

• We offer colloidal silica for silicon wafer final polishing process, which can be used in both single-side and double-side polishing.

• We developed nano alkaline colloidal silica for chemical mechanical polishing( CMP )of silicon wafers, which has good dispersity and stability, enhances the material removal rate(MRR), and improved the surface roughness (Ra/Rz).

• We have the ability to develop suitable polishing slurry to meet the customer's needs in semiconductor manufacturing.

  
  

Details of Silicon Wafer Polishing Slurry

In the process of silicon wafer machine processing, including multi-line cutting, grinding and other processing processes which will leave damage layer on the surface. At this point, chemical mechanical polishing is needed to make the silicon wafer with good flatness and finish, and ensure the lattice integrity. Therefore, it is required that the silicon wafer polishing fluid can remove the damaged layer of the silicon wafer in the same time without destroying the lattice, so Kona chose different particle silica as the basic abrasive and developed rough and final silicon wafer polishing fluid.